Compound Semiconductor Products (US Only)

Goals

Design, simulate, fabricate, and characterize custom compound semiconductor devices and circuits (i.e. GaAs-, GaN-, or InP-based). The team will partner with Sandia National Laboratories for mentorship on EDA/PDK tools and applications and access to national laboratory resources for design, simulation, fabrication, test and characterization.

Issues Involved or Addressed

Over the course of the VIP program, students will have the opportunity to experience various stages of compound semiconductor chip-scale microelectronics product research and development. Initial emphasis will be on topics such as: market analysis for advanced technology solutions, product specification development, electronic design automation (EDA)tools implementation, process design kit (PDK) development, implementation and validation, small-scale analog circuit (i.e. Amplifiers, power regulators/shifters, etc) design, simulation, fabrication and electrical characterization, printed circuit board prototyping, and foundry service assessments. As capabilities are established, future topics may include heterointegration and advanced packaging or thermal modeling and simulations. It is the goal that over the course of a few semesters, students would be able to design, simulate, fabricate, and characterize custom compound semiconductor devices and circuits. Due to ITAR export controls and other potential access restrictions this project is limited to US Persons only. The team will partner with Sandia National Laboratories for mentorship on EDA/PDK tools and applications and access to national laboratory resources for design, simulation, fabrication, test and characterization. Other partners may evolve as continued investments by the CHIPS and Science Act and other initiatives and industry provide opportunity for teaming on foundry services or advanced prototyping.

Partners/Sponsors

Sandia National Laboratories